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Chemtronics Soder-Wick Rosi - 80-3-10

$10.24
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SKU: 80-3-10
California prop 65
Description

Description

Description

  • Key Performance Benefit: State-of-the-art desoldering braid designed for heat-sensitive electronic components, offering fast response and improved thermal conductivity to minimize overheating and prevent PCB damage.
  • Material & Construction: Lighter mass pure copper braid construction; noncorrosive ultra high purity Type R rosin flux; sealed in nitrogen-purged packaging to prevent corrosion and moisture-related performance loss; packaged in ESD-safe static dissipative bobbins; available in 5' and 10' spools.
  • Risk Reduction/Compliance Benefit: Minimizes risk of heat damage to boards; reduces risk of static electricity damage; will not leave ionic contamination; nitrogen-purged packaging protects against corrosion and moisture exposure.
  • Protection Level: Complies with MIL-F-14256 F Type R flux; NASA-STD-8739.3 Soldered Electrical Connections; DOD-STD-883E Method 2022; ANSI/IPC J STD-004 Type ROL0.
  • Comfort & Usability: Responds faster than conventional desoldering braids; BGA braid sized for BGA pad and chip rework/repair; cleans entire BGA pads in three to four passes; packaged in ESD-safe static dissipative bobbins; 12 cans per case.
  • Safety & Compliance Assurance: Meets MIL-F-14256 F; NASA-STD-8739.3; DOD-STD-883E Method 2022; ANSI/IPC J STD-004 Type ROL0; designed for PCB repair and prototyping applications.

Recommended For

  • PCB repair
  • Prototyping
  • BGA pad rework and repair
  • Chip rework applications
  • Electronic component desoldering
  • Applications requiring Type ROL0 rosin flux

Product Details

  • Product Type: Desoldering Braid (Wick)
  • Flux Type: Type R Rosin (ROL0)
  • Construction: Pure Copper Braid
  • Packaging: Nitrogen-Purged
  • Spool Lengths: 5' and 10'
  • Bobbin Type: ESD-Safe Static Dissipative
  • Units Per Case: 12 Cans
  • Categories: Desoldering Braid (Wick), Soder-Wick
  • Applications: PCB Repair & Prototyping

Primary Industries

  • Electronics Manufacturing
  • PCB Repair
  • Prototyping

Standards and Certifications

  • MIL-F-14256 F Type R Flux
  • NASA-STD-8739.3
  • DOD-STD-883E, Method 2022
  • ANSI/IPC J STD-004, Type ROL0
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Reviews

FAQs

What is Soder-Wick Rosin Desoldering Braid used for?

Soder-Wick Rosin Desoldering Braid is used to remove solder from printed circuit boards during repair, rework, and prototyping. It is designed for efficient desoldering of electronic components, including surface mount devices and BGA pads, helping technicians correct soldering errors or replace components.

How does Soder-Wick Rosin protect heat-sensitive components?

Soder-Wick Rosin features a lighter mass pure copper braid that responds quickly to heat and improves thermal conductivity. This fast response helps draw solder away efficiently, reducing prolonged heat exposure and minimizing the risk of overheating or damaging delicate PCB traces and components.

What type of flux is used in Soder-Wick Rosin?

Soder-Wick Rosin uses a noncorrosive, ultra high purity Type R rosin flux classified as ROL0. This flux is designed to leave minimal ionic contamination while providing reliable solder absorption performance, supporting clean and compliant desoldering in electronics manufacturing and repair environments.

How does the packaging help maintain product performance?

Soder-Wick Rosin is sealed in nitrogen-purged packaging to prevent corrosion and protect against moisture-related degradation. It is also supplied on ESD-safe static dissipative bobbins to reduce the risk of electrostatic discharge damage during handling and use in sensitive electronic applications.

Does Soder-Wick Rosin meet industry standards?

Yes, Soder-Wick Rosin complies with MIL-F-14256 F Type R flux requirements, NASA-STD-8739.3 for soldered electrical connections, DOD-STD-883E Method 2022, and ANSI/IPC J-STD-004 Type ROL0. These standards support its use in regulated and high-reliability electronics applications.